Shieldless, High-Speed Electrical Connectors

ABSTRACT

An electrical connector that includes a mass disposed within the connector such that the connector has a first center of gravity in the absence of the mass and a second center of gravity with the mass is disclosed. Such a connector may include a connector housing and an insert molded leadframe assembly (IMLA) positioned within the connector housing. The IMLA may include an array of electrically-conductive contacts and a dielectric leadframe housing overmolded onto the array of contacts. The mass may be disposed within the connector such that the mass causes the connector to be balanced. The connector may be unbalanced about the first center of gravity and balanced about the second center of gravity. The connector may be a right angle, ball grid array connector.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.11/326,061, filed Jan. 5, 2006, which is a continuation of U.S. patentapplication Ser. No. 10/634,547, filed Aug. 5, 2003, now U.S. Pat. No.6,994,569, which is a continuation-in-part of U.S. patent applicationSer. No. 10/294,966, filed Nov. 14, 2002, now U.S. Pat. No. 6,976,886,which is a continuation in part of U.S. patent application Ser. No.10/155,786, filed May 24, 2002, now U.S. Pat. No. 6,652,318, and of U.S.patent application Ser. No. 09/990,794, filed Nov. 14, 2001, now U.S.Pat. No. 6,692,272. The contents of each of the above-referenced U.S.patents and patent applications are incorporated herein by reference intheir entireties.

FIELD OF THE INVENTION

Generally, the invention relates to the field of electrical connectors.More particularly, the invention relates to connectors that areinitially unbalanced about their initial center of gravity.

BACKGROUND OF THE INVENTION

Electrical connectors provide signal connections between electronicdevices using signal contacts. Often, the signal contacts are so closelyspaced that undesirable interference, or “cross talk,” occurs betweenadjacent signal contacts. As used herein, the term “adjacent” refers tocontacts (or rows or columns) that are next to one another. Cross talkoccurs when one signal contact induces electrical interference in anadjacent signal contact due to intermingling electrical fields, therebycompromising signal integrity. With electronic device miniaturizationand high speed, high signal integrity electronic communications becomingmore prevalent, the reduction of cross talk becomes a significant factorin connector design.

One commonly used technique for reducing cross talk is to positionseparate electrical shields, in the form of metallic plates, forexample, between adjacent signal contacts. The shields act to blockcross talk between the signal contacts by blocking the intermingling ofthe contacts' electric fields. FIGS. 1A and 1B depict exemplary contactarrangements for electrical connectors that use shields to block crosstalk.

FIG. 1A depicts an arrangement in which signal contacts S and groundcontacts G are arranged such that differential signal pairs S+, S− arepositioned along columns 101-106. As shown, shields 112 can bepositioned between contact columns 101-106. A column 101-106 can includeany combination of signal contacts S+, S− and ground contacts G. Theground contacts G serve to block cross talk between differential signalpairs in the same column. The shields 112 serve to block cross talkbetween differential signal pairs in adjacent columns.

FIG. 1B depicts an arrangement in which signal contacts S and groundcontacts G are arranged such that differential signal pairs S+, S− arepositioned along rows 111-116. As shown, shields 122 can be positionedbetween rows 111-116. A row 111-116 can include any combination ofsignal contacts S+, S− and ground contacts G. The ground contacts Gserve to block cross talk between differential signal pairs in the samerow. The shields 122 serve to block cross talk between differentialsignal pairs in adjacent rows.

Because of the demand for smaller, lower weight communicationsequipment, it is desirable that connectors be made smaller and lower inweight, while providing the same performance characteristics. Shieldstake up valuable space within the connector that could otherwise be usedto provide additional signal contacts, and thus limit contact density(and, therefore, connector size). Additionally, manufacturing andinserting such shields substantially increase the overall costsassociated with manufacturing such connectors. In some applications,shields are known to make up 40% or more of the cost of the connector.Another known disadvantage of shields is that they lower impedance.Thus, to make the impedance high enough in a high contact densityconnector, the contacts would need to be so small that they would not berobust enough for many applications.

The dielectrics that are typically used to insulate the contacts andretain them in position within the connector also add undesirable costand weight.

Therefore, a need exists for a lightweight, high-speed electricalconnector (i.e., one that operates above 1 Gb/s and typically in therange of about 10 Gb/s) that reduces the occurrence of cross talkwithout the need for separate shields, and provides for a variety ofother benefits not found in prior art connectors.

SUMMARY OF THE INVENTION

The invention provides an electrical connector that includes a massdisposed within the connector such that the connector has a first centerof gravity in the absence of the mass and a second center of gravitywith the mass. Such a connector may include a connector housing and aninsert molded leadframe assembly (IMLA) positioned within the connectorhousing. The IMLA may include an array of electrically-conductivecontacts and a dielectric leadframe housing overmolded onto the array ofcontacts. The mass may be disposed within the connector such that themass causes the connector to be balanced. The connector may beunbalanced about the first center of gravity and balanced about thesecond center of gravity. The connector may be a right angle, ball gridarray connector.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B depict exemplary contact arrangements for electricalconnectors that use shields to block cross talk.

FIG. 2A is a schematic illustration of an electrical connector in whichconductive and dielectric elements are arranged in a generally “I”shaped geometry.

FIG. 2B depicts equipotential regions within an arrangement of signaland ground contacts.

FIG. 3A illustrates a conductor arrangement used to measure the effectof offset on multi-active cross talk.

FIG. 3B is a graph illustrating the relationship between multi-activecross talk and offset between adjacent columns of terminals inaccordance with one aspect of the invention.

FIG. 3C depicts a contact arrangement for which cross talk wasdetermined in a worst case scenario.

FIGS. 4A-4C depict conductor arrangements in which signal pairs arearranged in columns.

FIG. 5 depicts a conductor arrangement in which signal pairs arearranged in rows.

FIG. 6 is a diagram showing an array of six columns of terminalsarranged in accordance with one aspect of the invention.

FIG. 7 is a diagram showing an array of six columns arranged inaccordance with another embodiment of the invention.

FIG. 8 is a perspective view of an illustrative right angle electricalconnector, in accordance with the invention.

FIG. 9 is a side view of the right angle electrical connector of FIG. 8.

FIG. 10 is an end view of a portion of the right angle electricalconnector of FIG. 8.

FIG. 11 is a top view of a portion of the right angle electricalconnector of FIG. 8.

FIG. 12 is a top cut-away view of conductors of the right angleelectrical connector of FIG. 9 taken along line B-B.

FIG. 13A is a side cut-away view of a portion of the right angleelectrical connector of FIG. 9 taken along line A-A.

FIG. 13B is a cross-sectional view taken along line C-C of FIG. 13A.

FIG. 14 is a perspective view of illustrative conductors of a rightangle electrical connector according to the invention.

FIG. 15 is a perspective view of another illustrative conductor of theright angle electrical connector of FIG. 8.

FIG. 16A is a perspective view of a backplane system having an exemplaryright angle electrical connector.

FIG. 16B is a simplified view of an alternative embodiment of abackplane system with a right angle electrical connector.

FIG. 16C is a simplified view of a board-to-board system having avertical connector.

FIG. 17 is a perspective view of the connector plug portion of theconnector shown in FIG. 16A.

FIG. 18 is a side view of the plug connector of FIG. 17.

FIG. 19A is a side view of a lead assembly of the plug connector of FIG.17.

FIG. 19B depicts the lead assembly of FIG. 19 during mating.

FIG. 20 is an end view of two columns of terminals in accordance withone embodiment of the invention.

FIG. 21 is a side view of the terminals of FIG. 20.

FIG. 22 is a perspective top view of a receptacle in accordance withanother embodiment of the invention.

FIG. 23 is a side view of the receptacle of FIG. 22.

FIG. 24 is a perspective view of a single column of receptacle contacts.

FIG. 25 is a perspective view of a connector in accordance with anotherembodiment of the invention.

FIG. 26 is a side view of a column of right angle terminals inaccordance with another aspect of the invention.

FIGS. 27 and 28 are front views of the right angle terminals of FIG. 26taken along lines A-A and lines B-B respectively.

FIG. 29 illustrates the cross section of terminals as the terminalsconnect to vias on an electrical device in accordance with anotheraspect of the invention.

FIG. 30 is a perspective view of a portion of another illustrative rightangle electrical connector, in accordance with the invention.

FIG. 31 is a perspective view of another illustrative right angleelectrical connector, in accordance with the invention.

FIG. 32 is a perspective view of an alternative embodiment of areceptacle connector.

FIG. 33 is a flow diagram of a method for making a connector inaccordance with the invention.

FIGS. 34A and 34B are perspective views of example embodiments of aheader assembly for a connector according to the invention.

FIGS. 35A and 35B are perspective views of example embodiments of areceptacle assembly for a connector according to the invention.

FIG. 36 is a side view of an example embodiment of a connector accordingto the invention connecting signal paths between two circuit boards.

FIG. 37 is a side view of an example embodiment of an insert molded leadassembly according to the invention.

FIGS. 38A-38C depict example contact designations for an IMLA such asdepicted in FIG. 37.

FIG. 39 is a side view of another example embodiment of an insert moldedlead assembly according to the invention.

FIGS. 40A-40C depict example contact designations for an IMLA such asdepicted in FIG. 39.

FIG. 41 depicts example differential signal pair contact designationsfor adjacent contact arrays.

FIGS. 42A-D provide graphs of measured performance for adjacent contactarrays such as depicted in FIG. 41.

FIG. 43 depicts example single-ended signal contact designations foradjacent contact arrays.

FIGS. 44A-E provide graphs of measured performance for adjacent contactarrays such as depicted in FIG. 43.

FIGS. 45A-45F provide cross-talk measurements for a single-endedaggressor injecting noise onto a differential pair.

FIGS. 46A-46F provide cross-talk measurements for a differential pairaggressor injecting noise onto a single-ended contact.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

Certain terminology may be used in the following description forconvenience only and should not be considered as limiting the inventionin any way. For example, the terms “top,” “bottom,” “left,” “right,”“upper,” and “lower” designate directions in the figures to whichreference is made. Likewise, the terms “inwardly” and “outwardly”designate directions toward and away from, respectively, the geometriccenter of the referenced object. The terminology includes the wordsabove specifically mentioned, derivatives thereof, and words of similarimport.

I-Shaped Geometry for Electrical Connectors—Theoretical Model

FIG. 2A is a schematic illustration of an electrical connector in whichconductive and dielectric elements are arranged in a generally “I”shaped geometry. Such connectors are embodied in the assignee's “I-BEAM”technology, and are described and claimed in U.S. Pat. No. 5,741,144,entitled “Low Cross And Impedance Controlled Electric Connector,” thedisclosure of which is herein incorporated by reference in its entirety.Low cross talk and controlled impedance have been found to result fromthe use of this geometry.

As shown in FIG. 2A, the conductive element can be perpendicularlyinterposed between two parallel dielectric and ground plane elements.The description of this transmission line geometry as I-shaped comesfrom the vertical arrangement of the signal conductor shown generally atnumeral 10 between the two horizontal dielectric layers 12 and 14 havinga dielectric constant ∈ and ground planes 13 and 15 symmetrically placedat the top and bottom edges of the conductor. The sides 20 and 22 of theconductor are open to the air 24 having an air dielectric constant ∈₀.In a connector application, the conductor could include two sections, 26and 28, that abut end-to-end or face-to-face. The thickness, t₁ and t₂of the dielectric layers 12 and 14, to first order, controls thecharacteristic impedance of the transmission line and the ratio of theoverall height h to dielectric width w_(d) controls the electric andmagnetic field penetration to an adjacent contact. Originalexperimentation led to the conclusion that the ratio h/w_(d) needed tominimize interference beyond A and B would be approximately unity (asillustrated in FIG. 2A).

The lines 30, 32, 34, 36 and 38 in FIG. 2A are equipotentials of voltagein the air-dielectric space. Taking an equipotential line close to oneof the ground planes and following it out towards the boundaries A andB, it will be seen that both boundary A or boundary B are very close tothe ground potential. This means that virtual ground surfaces exist ateach of boundary A and boundary B. Therefore, if two or more I-shapedmodules are placed side-by-side, a virtual ground surface exists betweenthe modules and there will be little to no intermingling of the modules'fields. In general, the conductor width w_(c) and dielectric thicknessest₁, t₂ should be small compared to the dielectric width w_(d) or modulepitch (i.e., distance between adjacent modules).

Given the mechanical constraints on a practical connector design, it wasfound in actuality that the proportioning of the signal conductor(blade/beam contact) width and dielectric thicknesses could deviatesomewhat from the preferred ratios and some minimal interference mightexist between adjacent signal conductors. However, designs using theabove-described I-shaped geometry tend to have lower cross talk thanother conventional designs.

Exemplary Factors Affecting Cross Talk Between Adjacent Contacts

In accordance with the invention, the basic principles described abovewere further analyzed and expanded upon and can be employed to determinehow to even further limit cross talk between adjacent signal contacts,even in the absence of shields between the contacts, by determining anappropriate arrangement and geometry of the signal and ground contacts.FIG. 2B includes a contour plot of voltage in the neighborhood of anactive column-based differential signal pair S+, S− in a contactarrangement of signal contacts S and ground contacts G according to theinvention. As shown, contour lines 42 are closest to zero volts, contourlines 44 are closest to −1 volt, and contour lines 46 are closest to +1volt. It has been observed that, although the voltage does notnecessarily go to zero at the “quiet” differential signal pairs that arenearest to the active pair, the interference with the quiet pairs isnear zero. That is, the voltage impinging on the positive-going quietdifferential pair signal contact is about the same as the voltageimpinging on the negative-going quiet differential pair signal contact.Consequently, the noise on the quiet pair, which is the difference involtage between the positive- and negative-going signals, is close tozero.

Thus, as shown in FIG. 2B, the signal contacts S and ground contacts Gcan be scaled and positioned relative to one another such that adifferential signal in a first differential signal pair produces a highfield H in the gap between the contacts that form the signal pair and alow (i.e., close to ground potential) field L (close to groundpotential) near an adjacent signal pair. Consequently, cross talkbetween adjacent signal contacts can be limited to acceptable levels forthe particular application. In such connectors, the level of cross talkbetween adjacent signal contacts can be limited to the point that theneed for (and cost of) shields between adjacent contacts is unnecessary,even in high speed, high signal integrity applications.

Through further analysis of the above-described I-shaped model, it hasbeen found that the unity ratio of height to width is not as critical asit first seemed. It has also been found that a number of factors canaffect the level of cross talk between adjacent signal contacts. Anumber of such factors are described in detail below, though it isanticipated that there may be others. Additionally, though it ispreferred that all of these factors be considered, it should beunderstood that each factor may, alone, sufficiently limit cross talkfor a particular application. Any or all of the following factors may beconsidered in determining a suitable contact arrangement for aparticular connector design:

a) Less cross talk has been found to occur where adjacent contacts areedge-coupled (i.e., where the edge of one contact is adjacent to theedge of an adjacent contact) than where adjacent contacts are broad sidecoupled (i.e., where the broad side of one contact is adjacent to thebroad side of an adjacent contact) or where the edge of one contact isadjacent to the broad side of an adjacent contact. The tighter the edgecoupling, the less the coupled signal pair's electrical field willextend towards an adjacent pair and the less towards the unityheight-to-width ratio of the original I-shaped theoretical model aconnector application will have to approach. Edge coupling also allowsfor smaller gap widths between adjacent connectors, and thus facilitatesthe achievement of desirable impedance levels in high contact densityconnectors without the need for contacts that are too small to performadequately. For example, it has been found that a gap of about 0.3-0.4mm is adequate to provide an impedance of about 100 ohms where thecontacts are edge coupled, while a gap of about 1 mm is necessary wherethe same contacts are broad side coupled to achieve the same impedance.Edge coupling also facilitates changing contact width, and therefore gapwidth, as the contact extends through dielectric regions, contactregions, etc.;

b) It has also been found that cross talk can be effectively reduced byvarying the “aspect ratio,” i.e., the ratio of column pitch (i.e., thedistance between adjacent columns) to the gap between adjacent contactsin a given column;

c) The “staggering” of adjacent columns relative to one another can alsoreduce the level of cross talk. That is, cross talk can be effectivelylimited where the signal contacts in a first column are offset relativeto adjacent signal contacts in an adjacent column. The amount of offsetmay be, for example, a full row pitch (i.e., distance between adjacentrows), half a row pitch, or any other distance that results inacceptably low levels of cross talk for a particular connector design.It has been found that the optimal offset depends on a number offactors, such as column pitch, row pitch, the shape of the terminals,and the dielectric constant(s) of the insulating material(s) around theterminals, for example. It has also been found that the optimal offsetis not necessarily “on pitch,” as was often thought. That is, theoptimal offset may be anywhere along a continuum, and is not limited towhole fractions of a row pitch (e.g., full or half row pitches).

FIG. 3A illustrates a contact arrangement that has been used to measurethe effect of offset between adjacent columns on cross talk. Fast (e.g.,40 ps) rise-time differential signals were applied to each of ActivePair 1 and Active Pair 2. Near-end crosstalk Nxt1 and Nxt2 weredetermined at Quiet Pair, to which no signal was applied, as the offsetd between adjacent columns was varied from 0 to 5.0 mm. Near-end crosstalk occurs when noise is induced on the quiet pair from the currentcarrying contacts in an active pair.

As shown in the graph of FIG. 3B, the incidence of multi-active crosstalk (thicker solid line in FIG. 3B) is minimized at offsets of about1.3 mm and about 3.65 mm. In this experiment, multi-active cross talkwas considered to be the sum of the absolute values of cross talk fromeach of Active Pair 1 (dashed line in FIG. 3B) and Active Pair 2 (thinsolid line in FIG. 3B). Thus, it has been shown that adjacent columnscan be variably offset relative to one another until an optimum level ofcross talk between adjacent pairs (about 1.3 mm, in this example);

d) Through the addition of outer grounds, i.e., the placement of groundcontacts at alternating ends of adjacent contact columns, both near-endcross talk (“NEXT”) and far-end cross talk (“FEXT”) can be furtherreduced;

e) It has also been found that scaling the contacts (i.e., reducing theabsolute dimensions of the contacts while preserving their proportionaland geometric relationship) provides for increased contact density(i.e., the number of contacts per linear inch) without adverselyaffecting the electrical characteristics of the connector.

By considering any or all of these factors, a connector can be designedthat delivers high-performance (i.e., low incidence of cross talk),high-speed (e.g., greater than 1 Gb/s and typically about 10 Gb/s)communications even in the absence of shields between adjacent contacts.It should also be understood that such connectors and techniques, whichare capable of providing such high speed communications, are also usefulat lower speeds. Connectors according to the invention have been shown,in worst case testing scenarios, to have near-end cross talk of lessthan about 3% and far-end cross talk of less than about 4%, at 40picosecond rise time, with 63.5 mated signal pairs per linear inch. Suchconnectors can have insertion losses of less than about 0.7 dB at 5 GHz,and impedance match of about 100±8 ohms measured at a 40 picosecond risetime.

FIG. 3C depicts a contact arrangement for which cross talk wasdetermined in a worst case scenario. Cross talk from each of sixattacking pairs S1, S2, S3, S4, S5, and S6 was determined at a “victim”pair V. Attacking pairs S1, S2, S3, S4, S5, and S6 are six of the eightnearest neighboring pairs to signal pair V. It has been determined thatthe additional affects on cross talk at victim pair V from attackingpairs S7 and S8 is negligible. The combined cross talk from the sixnearest neighbor attacking pairs has been determined by summing theabsolute values of the peak cross talk from each of the pairs, whichassumes that each pair is fairing at the highest level all at the sametime. Thus, it should be understood that this is a worst case scenario,and that, in practice, much better results should be achieved.

Exemplary Contact Arrangements According to the Invention

FIG. 4A depicts a connector 100 according to the invention havingcolumn-based differential signal pairs (i.e., in which differentialsignal pairs are arranged into columns). (As used herein, a “column”refers to the direction along which the contacts are edge coupled. A“row” is perpendicular to a column.) As shown, each column 401-406comprises, in order from top to bottom, a first differential signalpair, a first ground conductor, a second differential signal pair, and asecond ground conductor. As can be seen, first column 401 comprises, inorder from top to bottom, a first differential signal pair comprisingsignal conductors S1+ and S1−, a first ground conductor G, a seconddifferential signal pair comprising signal conductors S7+ and S7−, and asecond ground conductor G. Each of rows 413 and 416 comprises aplurality of ground conductors G. Rows 411 and 412 together comprise sixdifferential signal pairs, and rows 514 and 515 together compriseanother six differential signal pairs. The rows 413 and 416 of groundconductors limit cross talk between the signal pairs in rows 411-412 andthe signal pairs in rows 414-415. In the embodiment shown in FIG. 4A,arrangement of 36 contacts into columns can provide twelve differentialsignal pairs. Because the connector is devoid of shields, the contactscan be made relatively larger (compared to those in a connector havingshields). Therefore, less connector space is needed to achieve thedesired impedance.

FIGS. 4B and 4C depict connectors according to the invention thatinclude outer grounds. As shown in FIG. 4B, a ground contact G can beplaced at each end of each column. As shown in FIG. 4C, a ground contactG can be placed at alternating ends of adjacent columns. It has beenfound that the placement of a ground contact G at alternating ends ofadjacent columns results in a 35% reduction in NEXT and a 65% reductionin FEXT as compared to a connector having a contact arrangement that isotherwise the same, but which has no such outer grounds. It has alsobeen found that basically the same results can be achieved through theplacement of ground contacts at both ends of every contact column, asshown in FIG. 4B. Consequently, it is preferred to place outer groundsat alternating ends of adjacent columns in order to increase contactdensity (relative to a connector in which outer grounds are placed atboth ends of every column) without increasing the level of cross talk.

Alternatively, as shown in FIG. 5, differential signal pairs may bearranged into rows. As shown in FIG. 5, each row 511-516 comprises arepeating sequence of two ground conductors and a differential signalpair. First row 511 comprises, in order from left to right, two groundconductors G, a differential signal pair S1+, S1−, and two groundconductors G. Row 512 comprises in order from left to right, adifferential signal pair S2+, S2−, two ground conductors G, and adifferential signal pair S3+, S3−. The ground conductors block crosstalk between adjacent signal pairs. In the embodiment shown in FIG. 5,arrangement of 36 contacts into rows provides only nine differentialsignal pairs.

By comparison of the arrangement shown in FIG. 4A with the arrangementshown in FIG. 5, it can be understood that a column arrangement ofdifferential signal pairs results in a higher density of signal contactsthan does a row arrangement. However, for right angle connectorsarranged into columns, contacts within a differential signal pair havedifferent lengths, and therefore, such differential signal pairs mayhave intra-pair skew. Similarly, arrangement of signal pairs into eitherrows or columns may result in inter-pair skew because of the differentconductor lengths of different differential signal pairs. Thus, itshould be understood that, although arrangement of signal pairs intocolumns results in a higher contact density, arrangement of the signalpairs into columns or rows can be chosen for the particular application.

Regardless of whether the signal pairs are arranged into rows orcolumns, each differential signal pair has a differential impedance Z₀between the positive conductor Sx+ and negative conductor Sx− of thedifferential signal pair. Differential impedance is defined as theimpedance existing between two signal conductors of the samedifferential signal pair, at a particular point along the length of thedifferential signal pair. As is well known, it is desirable to controlthe differential impedance Z₀ to match the impedance of the electricaldevice(s) to which the connector is connected. Matching the differentialimpedance Z₀ to the impedance of electrical device minimizes signalreflection and/or system resonance that can limit overall systembandwidth. Furthermore, it is desirable to control the differentialimpedance Z₀ such that it is substantially constant along the length ofthe differential signal pair, i.e., such that each differential signalpair has a substantially consistent differential impedance profile.

The differential impedance profile can be controlled by the positioningof the signal and ground conductors. Specifically, differentialimpedance is determined by the proximity of an edge of signal conductorto an adjacent ground and by the gap between edges of signal conductorswithin a differential signal pair.

Referring again to FIG. 4A, the differential signal pair comprisingsignal conductors S6+ and S6− is located adjacent to one groundconductor G in row 413. The differential signal pair comprising signalconductors S12+ and S12− is located adjacent to two ground conductors G,one in row 413 and one in row 416. Conventional connectors include twoground conductors adjacent to each differential signal pair to minimizeimpedance matching problems. Removing one of the ground conductorstypically leads to impedance mismatches that reduce communicationsspeed. However, the lack of one adjacent ground conductor can becompensated for by reducing the gap between the differential signal pairconductors with only one adjacent ground conductor. For example, asshown in FIG. 4A, signal conductors S6+ and S6− can be located adistance d₁ apart from each other and signal conductors S12+ and S12−can be located a different distance d₄ apart from each other. Thedistances may be controlled by making the widths of signal conductorsS6+ and S6− wider than the widths of signal conductors S12+ and S12−(where conductor width is measured along the direction of the column).

For single ended signaling, single ended impedance can also becontrolled by positioning of the signal and ground conductors.Specifically, single ended impedance is determined by the gap between asignal conductor and an adjacent ground. Single ended impedance isdefined as the impedance existing between a signal conductor and ground,at a particular point along the length of a single ended signalconductor.

To maintain acceptable differential impedance control for high bandwidthsystems, it is desirable to control the gap between contacts to within afew thousandths of an inch. Gap variations beyond a few thousandths ofan inch may cause an unacceptable variation in the impedance profile;however, the acceptable variation is dependent on the speed desired, theerror rate acceptable, and other design factors.

FIG. 6 shows an array of differential signal pairs and ground contactsin which each column of terminals is offset from each adjacent column.The offset is measured from an edge of a terminal to the same edge ofthe corresponding terminal in the adjacent column. The aspect ratio ofcolumn pitch to gap width, as shown in FIG. 6, is P/X. It has been foundthat an aspect ratio of about 5 (i.e., 2 mm column pitch; 0.4 mm gapwidth) is adequate to sufficiently limit cross talk where the columnsare also staggered. Where the columns are not staggered, an aspect ratioof about 8-10 is desirable.

As described above, by offsetting the columns, the level of multi-activecross talk occurring in any particular terminal can be limited to alevel that is acceptable for the particular connector application. Asshown in FIG. 6, each column is offset from the adjacent column, in thedirection along the columns, by a distance d. Specifically, column 601is offset from column 602 by an offset distance d, column 602 is offsetfrom column 603 by a distance d, and so forth. Since each column isoffset from the adjacent column, each terminal is offset from anadjacent terminal in an adjacent column. For example, signal contact 680in differential pair DP3 is offset from signal contact 681 indifferential pair DP4 by a distance d as shown.

FIG. 7 illustrates another configuration of differential pairs whereineach column of terminals is offset relative to adjacent columns. Forexample, as shown, differential pair D2 in column 701 is offset fromdifferential pair D1 in the adjacent column 702 by a distance d. In thisembodiment, however, the array of terminals does not include groundcontacts separating each differential pair. Rather, the differentialpairs within each column are separated from each other by a distancegreater than the distance separating one terminal in a differential pairfrom the second terminal in the same differential pair. For example,where the distance between terminals within each differential pair is Y,the distance separating differential pairs can be Y+X, where Y+X/Y>>1.It has been found that such spacing also serves to reduce cross talk.

Exemplary Connector Systems According to the Invention

FIG. 8 is a perspective view of a right angle electrical connectoraccording to the invention that is directed to a high speed electricalconnector wherein signal conductors of a differential signal pair have asubstantially constant differential impedance along the length of thedifferential signal pair. As shown in FIG. 8, a connector 800 comprisesa first section 801 and a second section 802. First section 801 iselectrically connected to a first electrical device 810 and secondsection 802 is electrically connected to a second electrical device 812.Such connections may be SMT, PIP, solder ball grid array, press fit, orother such connections. Typically, such connections are conventionalconnections having conventional connection spacing between connectionpins; however, such connections may have other spacing betweenconnection pins. First section 801 and second section 802 can beelectrically connected together, thereby electrically connecting firstelectrical device 810 to second electrical device 812.

As can be seen, first section 801 comprises a plurality of modules 805.Each module 805 comprises a column of conductors 830. As shown, firstsection 801 comprises six modules 805 and each module 805 comprises sixconductors 830; however, any number of modules 805 and conductors 830may be used. Second section 802 comprises a plurality of modules 806.Each module 806 comprises a column of conductors 840. As shown, secondsection 802 comprises six modules 806 and each module 806 comprises sixconductors 840; however, any number of modules 806 and conductors 840may be used.

FIG. 9 is a side view of connector 800. As shown in FIG. 9, each module805 comprises a plurality of conductors 830 secured in a frame 850. Eachconductor 830 comprises a connection pin 832 extending from frame 850for connection to first electrical device 810, a blade 836 extendingfrom frame 850 for connection to second section 802, and a conductorsegment 834 connecting connection pin 832 to blade 836.

Each module 806 comprises a plurality of conductors 840 secured in frame852. Each conductor 840 comprises a contact interface 841 and aconnection pin 842. Each contact interface 841 extends from frame 852for connection to a blade 836 of first section 801. Each contactinterface 840 is also electrically connected to a connection pin 842that extends from frame 852 for electrical connection to secondelectrical device 812.

Each module 805 comprises a first hole 856 and a second hole 857 foralignment with an adjacent module 805. Thus, multiple columns ofconductors 830 may be aligned. Each module 806 comprises a first hole847 and a second hole 848 for alignment with an adjacent module 806.Thus, multiple columns of conductors 840 may be aligned.

Module 805 of connector 800 is shown as a right angle module. That is, aset of first connection pins 832 is positioned on a first plane (e.g.,coplanar with first electrical device 810) and a set of secondconnection pins 842 is positioned on a second plane (e.g., coplanar withsecond electrical device 812) perpendicular to the first plane. Toconnect the first plane to the second plane, each conductor 830 turns atotal of about ninety degrees (a right angle) to connect betweenelectrical devices 810 and 812.

To simplify conductor placement, conductors 830 can have a rectangularcross section; however, conductors 830 may be any shape. In thisembodiment, conductors 830 have a high ratio of width to thickness tofacilitate manufacturing. The particular ratio of width to thickness maybe selected based on various design parameters including the desiredcommunication speed, connection pin layout, and the like.

FIG. 10 is a side view of two modules of connector 800 taken along thecorresponding line shown in FIG. 9. FIG. 11 is a top view of two modulesof connector 800 taken along the corresponding line shown in FIG. 9. Ascan be seen, each blade 836 is positioned between two single beamcontacts 849 of contact interface 841, thereby providing electricalconnection between first section 801 and second section 802 anddescribed in more detail below. Connection pins 832 are positionedproximate to the centerline of module 805 such that connection pins 832may be mated to a device having conventional connection spacing.Connection pins 842 are positioned proximate to the centerline of module806 such that connection pins 842 may be mated to a device havingconventional connection spacing. Connection pins, however, may bepositioned at an offset from the centerline of module 806 if suchconnection spacing is supported by the mating device. Further, whileconnection pins are illustrated in the Figures, other connectiontechniques are contemplated such as, for example, solder balls and thelike.

Returning now to illustrative connector 800 of FIG. 8 to discuss thelayout of connection pins and conductors, first section 801 of connector800 comprises six columns and six rows of conductors 830. Conductors 830may be either signal conductors S or ground conductors G. Typically,each signal conductor S is employed as either a positive conductor or anegative conductor of a differential signal pair; however, a signalconductor may be employed as a conductor for single ended signaling. Inaddition, such conductors 830 may be arranged in either columns or rows.

In addition to conductor placement, differential impedance and insertionlosses are also affected by the dielectric properties of materialproximate to the conductors. Generally, it is desirable to havematerials having very low dielectric constants adjacent and in contactwith as much as the conductors as possible. Air is the most desirabledielectric because it allows for a lightweight connector and has thebest dielectric properties. While frame 850 and frame 852 may comprise apolymer, a plastic, or the like to secure conductors 830 and 840 so thatdesired gap tolerances may be maintained, the amount of plastic used isminimized. Therefore, the rest of connector comprises an air dielectricand conductors 830 and 840 are positioned both in air and only minimallyin a second material (e.g., a polymer) having a second dielectricproperty. Therefore, to provide a substantially constant differentialimpedance profile, in the second material, the spacing betweenconductors of a differential signal pair may vary.

As shown, the conductors can be exposed primarily to air rather thanbeing encased in plastic. The use of air rather than plastic as adielectric provides a number of benefits. For example, the use of airenables the connector to be formed from much less plastic thanconventional connectors. Thus, a connector according to the inventioncan be made lower in weight than convention connectors that use plasticas the dielectric. Air also allows for smaller gaps between contacts andthereby provides for better impedance and cross talk control withrelatively larger contacts, reduces cross-talk, provides less dielectricloss, increases signal speed (i.e., less propagation delay).

Through the use of air as the primary dielectric, a lightweight,low-impedance, low cross talk connector can be provided that is suitablefor use as a ball grid assembly (“BGA”) right-angle connector.Typically, a right angle connector is “off-balance, i.e.,disproportionately heavy in the mating area. Consequently, the connectortends to “tilt” in the direction of the mating area. Because the solderballs of the BGA, while molten, can only support a certain mass, priorart connectors typically are unable to include additional mass tobalance the connector. Through the use of air, rather than plastic, asthe dielectric, the mass of the connector can be reduced. Consequently,additional mass can be added to balance the connector without causingthe molten solder balls to collapse.

FIG. 12 illustrates the change in spacing between conductors in rows asconductors pass from being surrounded by air to being surrounded byframe 850. As shown in FIG. 12, at connection pin 832 the distancebetween conductor S+ and S− is D1. Distance D1 may be selected to matewith conventional connector spacing on first electrical device 810 ormay be selected to optimize the differential impedance profile. Asshown, distance D1 is selected to mate with a conventional connector andis positioned proximate to the centerline of module 805. As conductorsS+ and S− travel from connection pins 832 through frame 850, conductorsS+, S− jog towards each other, culminating in a separation distance D2in air region 860. Distance D2 is selected to give the desireddifferential impedance between conductor S+ and S−, given otherparameters, such as proximity to a ground conductor G. The desireddifferential impedance Z₀ depends on the system impedance (e.g., firstelectrical device 810), and may be 100 ohms or some other value.Typically, a tolerance of about 5 percent is desired; however, 10percent may be acceptable for some applications. It is this range of 10%or less that is considered substantially constant differentialimpedance.

As shown in FIG. 13A, conductors S+ and S− are positioned from airregion 860 towards blade 836 and jog outward with respect to each otherwithin frame 850 such that blades 836 are separated by a distance D3upon exiting frame 850. Blades 836 are received in contact interfaces841, thereby providing electrical connection between first section 801and second section 802. As contact interfaces 841 travel from air region860 towards frame 852, contact interfaces 841 jog outwardly with respectto each other, culminating in connection pins 842 separated by adistance of D4. As shown, connection pins 842 are positioned proximateto the centerline of frame 852 to mate with conventional connectorspacing.

FIG. 14 is a perspective view of conductors 830. As can be seen, withinframe 850, conductors 830 jog, either inwardly or outwardly to maintaina substantially constant differential impedance profile along theconductive path.

FIG. 15 is a perspective view of conductor 840 that includes two singlebeam contacts 849, one beam contact 849 on each side of blade 836. Thisdesign may provide reduced cross talk performance, because each singlebeam contact 849 is further away from its adjacent contact. Also, thisdesign may provide increased contact reliability, because it is a “true”dual contact. This design may also reduce the tight tolerancerequirements for the positioning of the contacts and forming of thecontacts.

As can be seen, within frame 852, conductor 840 jogs, either inward oroutward to maintain a substantially constant differential impedanceprofile and to mate with connectors on second electrical device 812. Forarrangement into columns, conductors 830 and 840 are positioned along acenterline of frames 850, 852, respectively.

FIG. 13B is a cross-sectional view taken along line C-C of FIG. 13A. Asshown in FIG. 13B, terminal blades 836 are received in contactinterfaces 841 such that beam contacts 839 engage respective sides ofblades 836. Preferably, the beam contacts 839 are sized and shaped toprovide contact between the blades 836 and the contact interfaces 841over a combined surface area that is sufficient to maintain theelectrical characteristics of the connector during mating and unmatingof the connector.

As shown in FIG. 13A, the contact design allows the edge-coupled aspectratio to be maintained in the mating region. That is, the aspect ratioof column pitch to gap width chosen to limit cross talk in theconnector, exists in the contact region as well, and thereby limitscross talk in the mating region. Also, because the cross-section of theunmated blade contact is nearly the same as the combined cross-sectionof the mated contacts, the impedance profile can be maintained even ifthe connector is partially unmated. This occurs, at least in part,because the combined cross-section of the mated contacts includes nomore than one or two thickness of metal (the thicknesses of the bladeand the contact interface), rather than three thicknesses as would betypical in prior art connectors (see FIG. 13B, for example). Unplugginga connector such as shown in FIG. 13B results in a significant change incross-section, and therefore, a significant change in impedance (whichcauses significant degradation of electrical performance if theconnector is not properly and completely mated). Because the contactcross-section does not change dramatically as the connector is unmated,the connector (as shown in FIG. 13A) can provide nearly the sameelectrical characteristics when partially unmated (i.e., unmated byabout 1-2 mm) as it does when fully mated.

FIG. 16A is a perspective view of a backplane system having an exemplaryright angle electrical connector in accordance with an embodiment of theinvention. As shown in FIG. 16A, connector 900 comprises a plug 902 andreceptacle 11100.

Plug 902 comprises housing 905 and a plurality of lead assemblies 908.The housing 905 is configured to contain and align the plurality of leadassemblies 908 such that an electrical connection suitable for signalcommunication is made between a first electrical device 910 and a secondelectrical device 912 via receptacle 1100. In one embodiment of theinvention, electrical device 910 is a backplane and electrical device912 is a daughtercard. Electrical devices 910 and 912 may, however, beany electrical device without departing from the scope of the invention.

As shown, the connector 902 comprises a plurality of lead assemblies908. Each lead assembly 908 comprises a column of terminals orconductors 930 therein as will be described below. Each lead assembly908 comprises any number of terminals 930.

FIG. 16B is backplane system similar to FIG. 16A except that theconnector 903 is a single device rather than mating plug and receptacle.Connector 903 comprises a housing and a plurality of lead assemblies(not shown). The housing is configured to contain and align theplurality of lead assemblies (not shown) such that an electricalconnection suitable for signal communication is made between a firstelectrical device 910 and a second electrical device 912

FIG. 16C is a board-to-board system similar to FIG. 16A except that plugconnector 905 is a vertical plug connector rather than a right angleplug connector. This embodiment makes electrical connection between twoparallel electrical devices 910 and 913. A vertical back-panelreceptacle connector according to the invention can be insert moldedonto a board, for example. Thus, spacing, and therefore performance, canbe maintained.

FIG. 17 is a perspective view of the plug connector of FIG. 16A shownwithout electrical devices 910 and 912 and receptacle connector 1100. Asshown, slots 907 are formed in the housing 905 that contain and alignthe lead assemblies 908 therein. FIG. 17 also shows connection pins 932,942. Connection pins 942 connect connector 902 to electrical device 912.Connection pins 932 electrically connect connector 902 to electricaldevice 910 via receptacle 1100. Connection pins 932 and 942 may beadapted to provide through-mount or surface-mount connections to anelectrical device (not shown).

In one embodiment, the housing 905 is made of plastic, however, anysuitable material may be used. The connections to electrical devices 910and 912 may be surface or through mount connections.

FIG. 18 is a side view of plug connector 902 as shown in FIG. 17. Asshown, the column of terminals contained in each lead assembly 908 areoffset from one another column of terminals in an adjacent lead assemblyby a distance D. Such an offset is discussed more fully above inconnection with FIGS. 6 and 7.

FIG. 19A is a side view of a single lead assembly 908. As shown in FIG.19A, one embodiment of lead assembly 908 comprises a metal lead frame940 and an insert molded plastic frame 933. In this manner, the insertmolded lead assembly 933 serves to contain one column of terminals orconductors 930. The terminals may comprise either differential pairs orground contacts. In this manner, each lead assembly 908 comprises acolumn of differential pairs 935A and 935B and ground contacts 937.

As is also shown in FIG. 19A, the column of differential pairs andground contacts contained in each lead assembly 908 are arranged in asignal-signal-ground configuration. In this manner, the top contact ofthe column of terminals in lead assembly 908 is a ground contact 937A.Adjacent to ground contact 937A is a differential pair 935A comprised ofa two signal contacts, one with a positive polarity and one with anegative polarity.

As shown, the ground contacts 937A and 937B extend a greater distancefrom the insert molded lead assembly 933. As shown in FIG. 19B, such aconfiguration allows the ground contacts 937 to mate with correspondingreceptacle contacts 1102G in receptacle 1100 before the signal contacts935 mate with corresponding receptacle contacts 1102S. Thus, theconnected devices (not shown in FIG. 19B) can be brought to a commonground before signal transmission occurs between them. This provides for“hot” connection of the devices.

Lead assembly 908 of connector 900 is shown as a right angle module. Toexplain, a set of first connection pins 932 is positioned on a firstplane (e.g., coplanar with first electrical device 910) and a set ofsecond connection pins 942 is positioned on a second plane (e.g.,coplanar with second electrical device 912) perpendicular to the firstplane. To connect the first plane to the second plane, each conductor930 is formed to extend a total of about ninety degrees (a right angle)to electrically connect electrical devices 910 and 912.

FIGS. 20 and 21 are end and side views, respectively, of two columns ofterminals in accordance with one aspect of the invention. As shown inFIGS. 20 and 21, adjacent columns of terminals are staggered in relationto one another. In other words, an offset exists between terminals inadjacent lead assemblies. In particular and as shown in FIGS. 20 and 21,an offset of distance d exists between terminals in column 1 andterminals in column 2. As shown, the offset d runs along the entirelength of the terminal. As stated above, the offset reduces theincidence of cross talk by furthering the distance between the signalcarrying contacts.

To simplify conductor placement, conductors 930 have a rectangular crosssection as shown in FIGS. 20 and 21. Conductors 930 may, however, be anyshape.

FIG. 22 is a perspective view of the receptacle portion of the connectorshown in FIG. 16A. Receptacle 1100 may be mated with connector plug 902(as shown in FIG. 16A) and used to connect two electrical devices (notshown). Specifically, connection pins 932 (as shown in FIG. 17) may beinserted into apertures 1142 to electrically connect connector 902 toreceptacle 1100. Receptacle 1100 also includes alignment structures 1120to aid in the alignment and insertion of connector 900 into receptacle1100. Once inserted, structures 1120 also serve to secure the connectoronce inserted into receptacle 1100. Such structures 1120 thereby preventany movement that may occur between the connector and receptacle thatcould result in mechanical breakage therebetween.

Receptacle 1100 includes a plurality of receptacle contact assemblies1160 each containing a plurality of terminals (only the tails of whichare shown). The terminals provide the electrical pathway between theconnector 900 and any mated electrical device (not shown).

FIG. 23 is a side view of the receptacle of FIG. 22 including structures1120, housing 1150 and receptacle lead assembly 1160. As shown, FIG. 23also shows that the receptacle lead assemblies may be offset from oneanother in accordance with the invention. As stated above, such offsetreduces the occurrence of multi-active cross talk as described above.

FIG. 24 is a perspective view of a single receptacle contact assemblynot contained in receptacle housing 1150. As shown, the assembly 1160includes a plurality of dual beam conductive terminals 1175 and a holder1168 made of insulating material. In one embodiment, the holder 1168 ismade of plastic injection molded around the contacts; however, anysuitable insulating material may be used without departing from thescope of the invention.

FIG. 25 is a perspective view of a connector in accordance with anotherembodiment of the invention. As shown, connector 1310 and receptacle1315 are used in combination to connect an electrical device, such ascircuit board 1305 to a cable 1325. Specifically, when connector 1310 ismated with receptacle 1315, an electrical connection is establishedbetween board 1305 and cable 1325. Cable 1325 can then transmit signalsto any electrical device (not shown) suitable for receiving suchsignals.

In another embodiment of the invention, it is contemplated that theoffset distance, d, may vary throughout the length of the terminals inthe connector. In this manner, the offset distance may vary along thelength of the terminal as well as at either end of the conductor. Toillustrate this embodiment and referring now to FIG. 26, a side view ofa single column of right angle terminals is shown. As shown, the heightof the terminals in section A is height H1 and the height of the crosssection of terminals in section B is height H2.

FIGS. 27 and 28 are end views of the columns of right angle terminalstaken along the corresponding lines shown in FIG. 26. In addition to thesingle column of terminals shown in FIG. 26, FIGS. 27 and 28 also showan adjacent column of terminals contained in the adjacent lead assemblycontained in the connector housing.

In accordance with the invention, the offset of adjacent columns mayvary along the length of the terminals within the lead assembly. Morespecifically, the offset between adjacent columns varies according toadjacent sections of the terminals. In this manner, the offset distancebetween columns is different in section A of the terminals than insection B of the terminals.

As shown in FIGS. 27 and 28, the cross sectional height of terminalstaken along line A-A in section A of the terminal is H1 and the crosssectional height of terminals in section B taken along line B-B isheight H2. As shown in FIG. 27, the offset of terminals in section A,where the cross sectional height of the terminal is H1, is a distanceD1.

Similarly, FIG. 28 shows the offset of the terminals in section B of theterminal. As shown, the offset distance between terminals in section Bof the terminal is D2. Preferably, the offset D2 is chosen to minimizecrosstalk, and may be different from the offset D1 because spacing orother parameters are different. The multi-active cross talk that occursbetween the terminals can thus be reduced, thereby increasing signalintegrity.

In another embodiment of the invention, to further reduce cross talk,the offset between adjacent terminal columns is different than theoffset between vias on a mated printed circuit board. A via isconducting pathway between two or more layers on a printed circuitboard. Typically, a via is created by drilling through the printedcircuit board at the appropriate place where two or more conductors willinterconnect.

To illustrate such an embodiment, FIG. 29 illustrates a front view of across section of four columns of terminals as the terminals mate to viason an electrical device. Such an electric device may be similar to thoseas illustrated in FIG. 16A. The terminals 1710 of the connector (notshown) are inserted into vias 1700 by connection pins (not shown). Theconnection pins, however, may be similar to those shown in FIG. 17.

In accordance with this embodiment of the invention, the offset betweenadjacent terminal columns is different than the offset between vias on amated printed circuit board. Specifically, as shown in FIG. 29, thedistance between the offset of adjacent column terminals is D1 and thedistance between the offset of vias in an electrical device is D2. Byvarying these two offset distances to their optimal values in accordancewith the invention, the cross talk that occurs in the connector of theinvention is reduced and the corresponding signal integrity ismaintained.

FIG. 30 is a perspective view of a portion of another embodiment of aright angle electrical connector 1100. As shown in FIG. 30, conductors930 are positioned from a first plane to a second plane that isorthogonal to the first plane. Distance D between adjacent conductors930 remains substantially constant, even though the width of conductor930 may vary and even though the path of conductor 930 may becircuitous. This substantially constant gap D provides a substantiallyconstant differential impedance along the length of the conductors.

FIG. 31 is a perspective view of another embodiment of a right angleelectrical connector 1200. As shown in FIG. 12, modules 1210 arepositioned in a frame 1220 to provide proper spacing between adjacentmodules 1210.

FIG. 32 is a perspective view of an alternate embodiment of a receptacleconnector 1100′. As shown in FIG. 32, connector 1100′ comprises a frame1190 to provide proper spacing between connection pins 1175′. Frame 1190comprises recesses, in which conductors 1175′ are secured. Eachconductor 1175′ comprises a single contact interface 1191 and aconnection pin 1192. Each contact interface 1191 extends from frame 1190for connection to a corresponding plug contact, as described above. Eachconnection pin 1942 extends from frame 1190 for electrical connection toa second electrical device. Receptacle connector 1190 may be assembledvia a stitching process.

To attain desirable gap tolerances over the length of conductors 903,connector 900 may be manufactured by the method as illustrated in FIG.33. As shown in FIG. 33, at step 1400, conductors 930 are placed in adie blank with predetermined gaps between conductors 930. At step 1410,polymer is injected into the die blank to form the frame of connector900. The relative position of conductors 930 are maintained by frame950. Subsequent warping and twisting caused by residual stresses canhave an effect on the variability, but if well designed, the resultantframe 950 should have sufficient stability to maintain the desired gaptolerances. In this manner, gaps between conductors 930 can becontrolled with variability of tenths of thousandths of an inch.

Preferably, to provide the best performance, the current carrying paththrough the connector should be made as highly conductive as possible.Because the current carrying path is known to be on the outer portion ofthe contact, it is desirable that the contacts be plated with a thinouter layer of a high conductivity material. Examples of such highconductivity materials include gold, copper, silver, and tin alloy.

Connectors Having Contacts that May be Selectively Designated

FIGS. 34A and 34B depict example embodiments of a header assembly for aconnector according to the invention. As shown, the header assembly 200may include a plurality of insert molded lead assemblies (IMLAs) 202.According to an aspect of the invention, an IMLA 202 may be used,without modification, for single-ended signaling, differentialsignaling, or a combination of single-ended signaling and differentialsignaling.

Each IMLA 202 includes plurality of electrically conductive contacts204. Preferably, the contacts 204 in each IMLA 202 form respectivelinear contact arrays 206. As shown, the linear contact arrays 206 arearranged as contact columns, though it should be understood that thelinear contact arrays could be arranged as contact rows. Also, thoughthe header assembly 200 is depicted with 150 contacts (i.e., 10 IMLAswith 15 contacts per IMLA), it should be understood that an IMLA mayinclude any desired number of contacts and a connector may include anynumber of IMLAs. For example, IMLAs having 12 or 9 electrical contactsare also contemplated. A connector according to the invention,therefore, may include any number of contacts.

The header assembly 200 includes an electrically insulating lead frame208 through which the contacts extend. Preferably, the lead frame 208 ismade of a dielectric material such as a plastic. According to an aspectof the invention, the lead frame 208 is constructed from as littlematerial as possible. Otherwise, the connector is air-filled. That is,the contacts may be insulated from one another using air as a seconddielectric. The use of air provides for a decrease in crosstalk and fora low-weight connector (as compared to a connector that uses a heavierdielectric material throughout).

The contacts 202 include terminal ends 210 for engagement with a circuitboard. Preferably, the terminal ends are compliant terminal ends, thoughit should be understood that the terminals ends could be press-fit orany surface-mount or through-mount terminal ends. The contacts alsoinclude mating ends 212 for engagement with complementary receptaclecontacts (described below in connection with FIGS. 35A-B).

As shown in FIG. 34A, a housing 214A is preferred. The housing 214Aincludes a first pair of end walls 216A. FIG. 34B depicts a headerassembly with a peripheral shield assembly 214B that includes a firstpair of end walls 216B and a second pair of end walls 218B.

According to an aspect of the invention, the header assembly may bedevoid of any internal shielding. That is, the header assembly may bedevoid of any shield plates, for example, between adjacent contactarrays. A connector according to the invention may be devoid of suchinternal shielding even for high-speed, high-frequency, fast rise-timesignaling.

Though the header assembly 200 depicted in FIGS. 34A-B is shown for aright-angle connector, it should be understood that a connectoraccording to the invention may be any style connector, such as amezzanine connector, for example. That is, an appropriate headerassembly may be designed according to the principles of the inventionfor any type connector.

FIGS. 35A and 35B depict an example embodiment of a receptacle assembly220 for a connector according to the invention. The receptacle assembly220 includes a plurality of receptacle contacts 224, each of which isadapted to receive a respective mating end 212. Further, the receptaclecontacts 224 are arranged in an arrangement that is complementary to thearrangement of the mating ends 212. Thus, the mating ends 212 may bereceived by the receptacle contacts 224 upon mating of the assemblies.Preferably, to complement the arrangement of the mating ends 212, thereceptacle contacts 224 are arranged to form linear contact arrays 226.Again, though the receptacle assembly 220 is depicted with 150 contacts(i.e., 15 contacts per column), it should be understood that a connectoraccording to the invention may include any number of contacts.

Each receptacle contact 224 has a mating end 230, for receiving a matingend 212 of a complementary header contact 204, and a terminal end 232for engagement with a circuit board. Preferably, the terminal ends 232are compliant terminal ends, though it should be understood that theterminals ends could be press-fit, balls, or any surface-mount orthrough-mount terminal ends. A housing 234 is also preferably providedto position and retain the IMLAs relative to one another.

According to an aspect of the invention, the receptacle assembly mayalso be devoid of any internal shielding. That is, the receptacleassembly may be devoid of any shield plates, for example, betweenadjacent contact arrays.

FIG. 36 depicts an example embodiment of a connector according to theinvention connecting signal paths between two circuit boards 240A-B.Circuit boards 240A-B may be mother and daughter boards, for example. Ingeneral, a circuit board 240A-B may include one or more differentialsignaling paths, one or more single-ended signaling paths, or acombination of differential signaling paths and single-ended signalingpaths. A signaling path typically includes an electrically conductivetrace 242 that is electrically connected to an electrically conductivepad 244. The terminals ends of the connector contacts are typicallyelectrically coupled to the conductive pads (e.g., by soldering, BGA,press-fitting, or other techniques well-known in the art). If thecircuit board is a multi-layer circuit board (as shown), the signalingpath may also include an electrically conductive via 243 that extendsthrough the circuit board.

Typically, a system manufacturer defines the signaling paths for a givenapplication. According to an aspect of the invention, the same connectormay be used, without structural modification, to connect eitherdifferential or single-ended signaling paths. According to an aspect ofthe invention, a system manufacturer may be provided with an electricalconnector as described above (that is, an electrical connectorcomprising a linear array of contacts that may be selectively designatedas either ground or signal contacts).

The system manufacturer may then designate the contacts as either groundor signal contacts, and electrically connect the connector to a circuitboard. The connector may be electrically connected to the circuit board,for example, by electrically connecting a contact designated as a signalcontact to a signaling path on the circuit board. The signaling path maybe a single-ended signaling path or a differential signaling path. Thecontacts may be designated to form any combination of differentialsignal pairs and/or single-ended signal conductors.

FIG. 37 is a side view of an example embodiment of an IMLA 202 accordingto the invention. The IMLA 202 includes a linear contact array 206 ofelectrically conductive contacts 204, and a lead frame 208 through whichthe contacts 204 at least partially extend. According to an aspect ofthe invention, the contacts 204 may be selectively designated as eitherground or signal contacts. In a first designation, the contacts form atleast one differential signal pair comprising a pair of signal contacts.In a second designation, the contacts form at least one single-endedsignal conductor. In a third designation, the contacts form at least onedifferential signal pair and at least one single-ended signal conductor.

FIGS. 38A-38C depict example contact designations for an IMLA such asdepicted in FIG. 37. As shown in FIG. 38A, contacts b, c, e, f, h, i, k,l, n, and o, for example, may be defined to be signal contacts, whilecontacts a, d, g, j, and m, for example, may be defined to be groundcontacts. In such a designation, signal contact pairs b-c, e-f, h-i,k-l, and n-o form differential signal pairs. As shown in FIG. 38B,contacts b, d, f, h, j, l, and n, for example, may be defined to besignal contacts, while contacts a, c, e, g, i, k, m, and o, for example,may be defined to be ground contacts. In such a designation, signalcontacts b, d, f, h, j, l, and n form single-ended signal conductors. Asshown in FIG. 38C, contacts b, c, e, f, h, j, l, and n, for example, maybe defined to be signal contacts, while contacts a, d, g, i, k, m, ando, for example, may be defined to be ground contacts. In such adesignation, signal contact pairs b-c and e-f form differential signalpairs, and signal contacts h, j, l, and n form single-ended signalconductors. It should be understood that, in general, each of thecontacts may thus be defined as either a signal contact or a groundcontact depending on the requirements of the application.

In each of the designations depicted in FIGS. 38A-38C, contacts g and mare ground contacts. As discussed in detail above, it may be desirable,though not necessary, for ground contacts to extend further than signalcontacts. This may be desired so that the ground contacts make contactbefore the signal contacts do, thus bringing the system to ground beforethe signal contacts are mated. Because contacts g and m are groundcontacts in either designation, the terminal ends of ground contacts gand m may be extended beyond the terminal ends of the other contacts sothat the ground contacts g and m mate before any of the signal contactsmate and, still, the IMLA can support either designation withoutmodification.

FIG. 39 is a side view of another example embodiment of an insert moldedlead assembly according to the invention. FIGS. 40A-40C depict examplecontact designations for an IMLA such as depicted in FIG. 39.

As shown in FIG. 40A, contacts a, b, d, e, g, h, j, k, m, and n, forexample, may be defined to be signal contacts, while contacts c, f, i,l, and o, for example, may be defined to be ground contacts. In such adesignation, signal contact pairs a-b, d-e, g-h, j-k, and m-n formdifferential signal pairs. As shown in FIG. 40B, contacts a, c, e, g, i,k, and m, and o for example, may be defined to be signal contacts, whilecontacts b, d, f, h, j, l, and n, for example, may be defined to beground contacts. In such a designation, signal contacts a, c, e, g, i,k, and m, and o form single-ended signal conductors. As shown in FIG.40C, contacts a, c, e, g, h, j, k, m, and n, for example, may be definedto be signal contacts, while contacts b, d, f, i, l, and o, for example,may be defined to be ground contacts. In such a designation, signalcontacts a, c, and e form single-ended signal conductors, and signalcontact pairs g-h, j-k, and m-n form differential signal pairs. Again,it should be understood that, in general, each of the contacts may thusbe defined as either a signal contact or a ground contact depending onthe requirements of the application. In each of the designationsdepicted in FIGS. 40A-40C, contacts f and l are ground contacts, theterminals ends of which may extend beyond the terminal ends of the othercontacts so that the ground contacts f and l mate before any of thesignal contacts mate.

The contact array may configured such that a desired impedance betweencontacts is achieved, and such that insertion loss and cross-talk arelimited to acceptable levels—even in the absence of shield platesbetween adjacent IMLAs. Further, because desired levels of impedance,insertion loss, and cross-talk may be achieved within a single IMLA evenin the absence of shields, a single IMLA may function as a connectorsystem independently of the presence or absence of adjacent IMLAs, andindependently of the designation of any adjacent IMLAs. In other words,an IMLA according to the invention does not require adjacent IMLAs tofunction properly.

Though the present invention provides for lightweight, high contactdensity connectors, contact density may be sacrificed in instances wheremanufacturing costs or specific product requirements negate the need forhigh density. Because an IMLA according to the invention does notrequire adjacent IMLAs to function properly, IMLAs may be spacedrelatively closely together or relatively far apart from one anotherwithout a significant reduction in performance. Greater IMLA spacingfacilitates the use of larger diameter contact wires, which are easierto make and manipulate using known automated production processes.

FIG. 41 depicts a contact arrangement for an adjacent pair of IMLAs I1,I2 wherein the contacts are defined to form a respective plurality ofdifferential signal pairs in each IMLA. For purposes of thisdescription, the linear contact arrays 246A and 246B may be consideredcontact columns. The rows are referred to as A-O. Signal contacts aredesignated by the letter of the corresponding row; ground contacts aredesignated by GND. As shown, contacts 1A and 1B form a pair, contacts 2Band 2C form a pair, etc.

A number of parameters may be considered in determining a suitablecontact array configuration for an IMLA according to the invention. Forexample, contact thickness and width, gap width between adjacentcontacts, and adjacent contact coupling may be considered in determininga suitable contact array configuration that provides acceptable oroptimal levels of impedance, insertion loss, and cross-talk, without theneed for shields between adjacent contact arrays, in an IMLA that may bedesignated as differential, single-ended, or a combination of both.Issues relating to the consideration of these and other such parametersare described in detail above. Though it should be understood that suchparameters may be tailored to fit the needs of a particular connectorapplication, an example connector according to the invention will now bedescribed to provide example parameter values and performance dataobtained for such a connector.

In an embodiment of the invention, each contact may have a contact widthW of about one millimeter, and contacts may be set on 1.4 millimetercenters C. Thus, adjacent contacts may have a gap width GW between themof about 0.4 millimeters. The IMLA may include a lead frame into orthrough which the contacts extend. The lead frame may have a thickness Tof about 0.35 millimeters. An IMLA spacing IS between adjacent contactarrays may be about two millimeters. Additionally, the contacts may beedge-coupled along the length of the contact arrays, and adjacentcontact arrays may be staggered relative to one another.

Generally, the ratio W/GW of contact width W to gap width GW betweenadjacent contacts will be greater in a connector according to theinvention than in prior art connectors that require shields betweenadjacent contact arrays. Such a connector is described in published U.S.patent application 2001/0005654A1. Typical connectors, such as thosedescribed in application 2001/0005654, require the presence of more thanone lead assembly because they rely on shield plates between adjacentlead assemblies. Such lead assemblies typically include a shield platedisposed along one side of the lead frame so that when lead frames areplaced adjacent to one another, the contacts are disposed between shieldplates along each side. In the absence of an adjacent lead frame, thecontacts would be shielded on only one side, which would result inunacceptable performance.

Because shield plates between adjacent contact arrays are not requiredin a connector according to the invention (because, as will be explainedin detail below, desired levels of cross-talk, impedance, and insertionloss may be achieved in a connector according to the invention becauseof the configuration of the contacts), an adjacent lead assembly havinga complementary shield is not required, and a single lead assembly mayfunction acceptably in the absence of any adjacent lead assembly.

FIG. 42A provides a reflection plot of differential impedance as afunction of signal propagation time through each of the differentialsignal pairs shown in FIG. 41. Differential impedance was measured foreach signal pair at various times as a signal propagated through a firsttest board, associated header vias, the signal pair, associatedreceptacle vias, and a second test board. As shown, each differentialsignal pair has a differential impedance of about 90-110 ohms, and thedifferential impedance is relatively constant (i.e., +/−about 5 ohmsover the length of the connector) through each of the signal pairs. Adifferential impedance of about 92-108 ohms is preferred The impedanceprofile for each signal pair is about the same as the impedance profilefor every other signal pair. Differential impedance was measured for a40 ps rise time from 10%-90% of signal level.

FIG. 42B provides a plot of insertion loss as a function of signalfrequency for each of the differential signal pairs shown in FIG. 41. Asshown, insertion loss is relatively constant (less than about −2 dB) forsignals up to 10 GHz, and insertion loss for each pair was about thesame as the insertion loss for every other pair.

FIGS. 42C and 42D provide, respectively, worst case measurements ofmulti-active near-end and far-end crosstalk as measured at each of thesignal pairs. The cross-talk was measured for 40 and 100 ps rise timesfrom 10%-90% of signal level.

FIG. 43 depicts a contact arrangement for an adjacent pair of IMLAswherein the contacts are defined to form a respective plurality ofsingle-ended signal conductors in each IMLA. The IMLAs are the same asthose depicted in FIG. 41, the only difference being the contactdefinitions. Again, the linear contact arrays 246A and 246B may beconsidered contact columns, and the rows are referred to as A-O. Signalcontacts are designated by the letter of the corresponding row; groundcontacts are designated by GND. As shown, contacts 1A, 2B, 1C, etc., aresingle-ended signal conductors.

FIG. 44A provides a reflection plot of single-ended impedance as afunction of signal propagation time through each of the signal contactsshown in FIG. 43. Single-ended impedance was measured for each signalcontact at various times as a signal propagated through a first testboard, an associated header via, the signal contact, an associatedreceptacle via, and a second test board. As shown, each single-endedsignal conductor has a single-ended impedance of about 40-70 ohms, andthe single-ended impedance is relatively constant (i.e., +/−about 10ohms over the length of the connector) through each of the signalcontacts. A single-ended impedance of about 40-60 ohms is preferred. Theimpedance profile for each signal contact is about the same as theimpedance profile for every other signal contact. Single-ended impedancewas measured for a 40 ps rise time from 10%-90% of signal level.

FIG. 44B provides a reflection plot of single-ended impedance as afunction of signal propagation time through each of the signal contactsshown in FIG. 43 measured for a 150 ps rise time from 20%-80% of signallevel.

FIG. 44C provides a plot of insertion loss as a function of signalfrequency for each of the signal contacts shown in FIG. 43. As shown,insertion loss is relatively constant (less than about −2 dB) forsignals up to about four GHz, and insertion loss for each contact wasabout the same as the insertion loss for every other contact.

FIGS. 44D and 44E provide, respectively, worst case measurements ofmulti-active near-end and far-end crosstalk as measured at each of thesignal contacts. The cross-talk was measured for a 150 ps rise time from20% to 80% of signal level.

FIGS. 45A-45F provide cross-talk measurements for a single-endedaggressor injecting noise onto a differential pair. Signal contacts aredesignated by the letter of the corresponding row; pairs are surroundedby boxes. Ground contacts are designated by GND. For each differentialpair in each array, half of the pair was driven (i.e., contacts B, E, H,K, and N). The near-end and far-end differential noise voltage wasmeasured on the adjacent pair. The non-driven half of the aggressor pairwas terminated in 50 ohms. Cross-talk percentages are shown forrise-times of 40 ps (10%-90%), 100 ps (10%-90%), and 150 ps (20%-80%).The numbers shown indicate the percentage of the single-ended signalvoltage that would show up as differential noise on the adjacentdifferential pair.

FIGS. 46A-46F provide cross-talk measurements for a differential pairaggressor injecting noise onto a single-ended contact. Again, signalcontacts are designated by the letter of the corresponding row, andground contacts are designated by GND. For each differential pair ineach array, the pair was driven, and the near-end single-ended voltagewas measured on one half of an adjacent pair (i.e., contacts B, E, H, K,and N). The unused half of the victim pair was terminated in 50 ohms.Cross-talk percentages are shown for rise-times of 40 ps (10%-90%), 100ps (10%-90%), and 150 ps (20%-80%). The numbers shown indicate thepercentage of the differential signal voltage that would show up assingle-ended noise on an adjacent single-ended contact.

In summation, the present invention can be a scalable, inverse two-piecebackplane connector system that is based upon an IMLA design that can beused for either differential pair or single ended signals within thesame IMLA. The column differential pairs demonstrate low insertion lossand low cross-talk from speeds less than approximately 2.5 Gb/sec togreater than approximately 12.5 Gb/sec. Exemplary configurations include150 position for 1.0 inch slot centers and 120 position for 0.8 slotcenters, all without interleaving shields. The IMLAs are stand-alone,which means that the IMLAs may be stacked into any centerline spacingrequired for customer density or routing considerations. Examplesinclude, but are certainly not limited to, 2 mm, 2.5 mm, 3.0 mm, or 4.0mm. By using air as a dielectric, there is improved low-lossperformance. By taking further advantage of electromagnetic couplingwithin each IMLA, the present invention helps to provide a shieldlessconnector with good signal integrity and EMI performance. The standalone IMLA permits an end user to specify whether to assign pins asdifferential pair signals, single ended signals, or power. At leasteighty Amps of capacity can be obtained in a low weight, high speedconnector.

It is to be understood that the foregoing illustrative embodiments havebeen provided merely for the purpose of explanation and are in no way tobe construed as limiting of the invention. Words which have been usedherein are words of description and illustration, rather than words oflimitation. Further, although the invention has been described hereinwith reference to particular structure, materials and/or embodiments,the invention is not intended to be limited to the particulars disclosedherein. Rather, the invention extends to all functionally equivalentstructures, methods and uses, such as are within the scope of theappended claims. Those skilled in the art, having the benefit of theteachings of this specification, may affect numerous modificationsthereto and changes may be made without departing from the scope andspirit of the invention in its aspects.

1. A connector, comprising: a connector housing; an insert moldedleadframe assembly (IMLA) positioned within the connector housing, theIMLA comprising an array of electrically-conductive contacts and adielectric leadframe housing overmolded onto the array of contacts; anda mass disposed within the connector such that the connector has a firstcenter of gravity in the absence of the mass and a second center ofgravity with the mass, wherein the connector is unbalanced about thefirst center of gravity and balanced about the second center of gravity.2. The connector of claim 1, wherein the connector is a right angle,ball grid array connector.
 3. A right angle connector, comprising: aconnector housing; an insert molded leadframe assembly (IMLA) positionedwithin the connector housing, the IMLA comprising an array ofelectrically-conductive contacts and a dielectric leadframe housingovermolded onto the array of contacts; and a mass disposed within theconnector such that the mass causes the right-angle connector to bebalanced.
 4. The connector of claim 3, wherein the connector is a rightangle, ball grid array connector.